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WG 1 Electrochemical processing methods

WG 1 Electrochemical processing methods

This WG will concentrate in the formulations and, if applicable, the electrochemical parameters (current/potential, pulses) required to micro- and nanofabricate key materials by means of an electrochemical processing technique. The complementarity and compatibility with other fabrication techniques will be also evaluated. Furthermore, environmental issues will be considered aiming at developing a sustainable and green chemistry. The WG is divided in three tasks:

Task 1.1: Development of new electrolyte formulations:

Development of new electrolyte formulations: In this task, new electrolyte formulations will be designed and tested. Several components of the electrolytes such as platable substances (ionic salts, monomers, polymers, nanoparticles), additives (stress reducers, surfactants, buffers, brighteners, levelers, complexing agents) and the solvents (aqueous, non-aqueous) will be studied. A database of electrolyte formulations currently used in the electrosynthesis of advanced materials at the micro- and nanoscale will be settled, with especial emphasis on the following data: efficiency of the process, resulting material properties, limitations, comparison with physical methods (ALD, MBE, CVD, PVD).

Task 1.2: Electrochemical schemes:

This task will investigate different strategies to deposit the materials such as electrodeposition, electroless, electrophoresis or electroforming. In case of electrode-based techniques, the way as the current/potential is applied will be investigated, that is, the use of current (galvanostatic) or potential (potentiostatic), the use of direct current/potential deposition or pulsed or reverse-pulsed deposition schemes.

Task 1.3: Complementarity of electrochemical methods with other processes:

The compatibility and complementarity of electrodeposition with other fabrication techniques is a key issue in a fabrication sequence. In this task, the potential drawbacks and advantages when an electrochemical processing technique is introduced in a fabrication sequence will be analyzed.


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